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Keywords: Advanced Packaging Process Engineer - Bonding, Location: Boise, ID

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Advanced Packaging Process Engineer - Bonding

process related problems Coordinate and execute process, equipment and material evaluation / optimization initiatives... and implement changes at process step Lead / participate in continuous yield improvement and cost reduction activities Validate...

Company: Micron
Location: Boise, ID
Posted Date: 08 Sep 2024

Advanced Packaging Process Development Engineer

to learn, communicate and advance faster than ever. As a Process Development Engineer in Micron's Advanced Technology... and packaging field Experience in wafer bonding, plating, warpage control and packaging process development and understanding...

Company: Micron
Location: Boise, ID
Posted Date: 09 Nov 2024

Process Integration Engineer - Advanced Packaging, TD - TPG

level bonding, or MS degree + 1-2(+) years of industry experience specific to Advanced Packaging and wafer-to-wafer bonding... into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Integration Engineer...

Company: Micron
Location: Boise, ID
Posted Date: 30 Oct 2024

DMTS APTD Process Integration Engineer

Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define technology... bonding. You will integrate process flows that involve thinning of wafers and through wafer interconnect schemes...

Company: Micron
Location: Boise, ID
Posted Date: 31 Oct 2024

Process Integration Engineer - APTD-TPG

Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define technology... bonding. You will integrate process flows that involve thinning of wafers and through wafer interconnect schemes...

Company: Micron
Location: Boise, ID
Posted Date: 30 Oct 2024

Customer Engagement Applications Engineer - Optical Inspection

depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes... during the hiring process. Company Overview KLA is a global leader in diversified electronics for the semiconductor...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 09 Oct 2024
Salary: $78100 - 132800 per year

Customer Engagement Applications Engineer - Optical Inspection

, logic, memory, automotive, MEMS, advanced packaging and other markets rely upon high-sample wafer inspection information... inspection that is critical for automotive IC, MEMS, and advanced packaging processes as well as foundry/logic and memory fabs...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 09 Oct 2024
Salary: $78100 - 132800 per year

Applications Development Engineer. - Optical inspection

for process debug and excursion monitoring at advanced process nodes. Job Responsibilities The candidate... during the hiring process. Company Overview KLA is a global leader in diversified electronics for the semiconductor...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 05 Oct 2024
Salary: $78100 - 132800 per year

Field Applications Engineer: Reticle and Photomask inspection systems

during the hiring process. Company Overview KLA is a global leader in diversified electronics for the semiconductor... without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 05 Oct 2024