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Keywords: Advanced Packaging Process Development Engineer, Location: Boise, ID

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Advanced Packaging Process Development Engineer

to learn, communicate and advance faster than ever. As a Process Development Engineer in Micron's Advanced Technology... and packaging field Experience in wafer bonding, plating, warpage control and packaging process development and understanding...

Company: Micron
Location: Boise, ID
Posted Date: 08 Nov 2024

Advanced Packaging Engineer

packaging techniques. What You Can Expect As a Signal and Power Integrity Engineer in the Advanced Packaging design team..., above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging team...

Company: Marvell
Location: Boise, ID
Posted Date: 15 Dec 2024
Salary: $94800 - 140300 per year

Part Operations Engineer - Advanced Packaging / HBM - TPG

company that is leading the way in transforming global information usage. As a Part Operations Engineer..., you will have a vital role in our Technology Development department. You will be in charge of coordinating, analyzing, and optimizing the...

Company: Micron
Location: Boise, ID
Posted Date: 30 Oct 2024

Advanced Modeling Sr. Engineer - TPG

. The modeling engineer will collaborate extensively with PI, process, and packaging teams for Multiphysics and multiscale... into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Advanced Modeling Sr. Engineer...

Company: Micron
Location: Boise, ID
Posted Date: 03 Dec 2024

MTS Process Integration Engineer | APTD

Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define technology... requirements, build program plans, and secure resources to drive process technology development programs. Your development focus...

Company: Micron
Location: Boise, ID
Posted Date: 17 Dec 2024

Applications Development Engineer. - Optical inspection

yield throughout their fabrication process—from research and development to final volume production. Responsibilities... for process debug and excursion monitoring at advanced process nodes. Job Responsibilities The candidate...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 05 Oct 2024
Salary: $78100 - 132800 per year

Principal Product Quality Engineer, High Bandwidth Memory

with semiconductor wafer fabrication, advanced packaging, and semiconductor device physics. 3 years or engineering experience... demonstrate your technical knowledge and creativity to deliver efficient and effective solutions. As a Principal Engineer...

Company: Micron
Location: Boise, ID
Posted Date: 12 Oct 2024

Senior Product Quality Engineer, High Bandwidth Memory

, advanced packaging, and semiconductor device physics. 3 years or engineering experience in one of the following areas... demonstrate your technical knowledge and creativity to deliver efficient and effective solutions. As a Senior Engineer...

Company: Micron
Location: Boise, ID
Posted Date: 11 Oct 2024

Customer Engagement Applications Engineer - Optical Inspection

yield throughout their fabrication process—from research and development to final volume production. Responsibilities... depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 09 Oct 2024
Salary: $78100 - 132800 per year

Customer Engagement Applications Engineer - Optical Inspection

yield throughout their fabrication process—from research and development to final volume production. Responsibilities..., logic, memory, automotive, MEMS, advanced packaging and other markets rely upon high-sample wafer inspection information...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 09 Oct 2024
Salary: $78100 - 132800 per year