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Keywords: Advanced Packaging Engineer, Location: Boise, ID

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Advanced Packaging Engineer

packaging techniques. What You Can Expect As a Signal and Power Integrity Engineer in the Advanced Packaging design team..., above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging team...

Company: Marvell
Location: Boise, ID
Posted Date: 15 Dec 2024
Salary: $94800 - 140300 per year

Advanced Packaging Process Development Engineer

to learn, communicate and advance faster than ever. As a Process Development Engineer in Micron's Advanced Technology... Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first...

Company: Micron
Location: Boise, ID
Posted Date: 09 Nov 2024

Part Operations Engineer - Advanced Packaging / HBM - TPG

company that is leading the way in transforming global information usage. As a Part Operations Engineer...

Company: Micron
Location: Boise, ID
Posted Date: 30 Oct 2024

Advanced Modeling Sr. Engineer - TPG

into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Advanced Modeling Sr. Engineer.... The modeling engineer will collaborate extensively with PI, process, and packaging teams for Multiphysics and multiscale...

Company: Micron
Location: Boise, ID
Posted Date: 04 Dec 2024

MTS Process Integration Engineer | APTD

Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define technology...’ experience in Advanced Packaging Industry Deep knowledge of Advanced Package Integration and DRAM or other memory. (3DIC, FO...

Company: Micron
Location: Boise, ID
Posted Date: 17 Dec 2024

Principal Product Quality Engineer, High Bandwidth Memory

with semiconductor wafer fabrication, advanced packaging, and semiconductor device physics. 3 years or engineering experience... demonstrate your technical knowledge and creativity to deliver efficient and effective solutions. As a Principal Engineer...

Company: Micron
Location: Boise, ID
Posted Date: 12 Oct 2024

Senior Product Quality Engineer, High Bandwidth Memory

, advanced packaging, and semiconductor device physics. 3 years or engineering experience in one of the following areas... demonstrate your technical knowledge and creativity to deliver efficient and effective solutions. As a Senior Engineer...

Company: Micron
Location: Boise, ID
Posted Date: 11 Oct 2024

Customer Engagement Applications Engineer - Optical Inspection

, logic, memory, automotive, MEMS, advanced packaging and other markets rely upon high-sample wafer inspection information... inspection that is critical for automotive IC, MEMS, and advanced packaging processes as well as foundry/logic and memory fabs...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 09 Oct 2024
Salary: $78100 - 132800 per year

Customer Engagement Applications Engineer - Optical Inspection

without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed... applications engineer in this position will be a key growth enabler for the Broadband Plasma Division (BBP). BBP provides market...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 08 Oct 2024
Salary: $78100 - 132800 per year

Applications Development Engineer. - Optical inspection

without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed... and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...

Company: KLA Corporation
Location: Boise, ID
Posted Date: 05 Oct 2024
Salary: $78100 - 132800 per year