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Keywords: Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly), Location: Central Region, Singapore

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Sr Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)

development. Utilize expertise in process integration between Fabrication (FAB) facilities and Outsourced Semiconductor Assembly... and assembly packaging processes for RF-SiP (Radio Frequency-System in Package) applications. Formulate industry-leading design...

Company: Qualcomm
Posted Date: 06 Feb 2025