team is looking for an advanced IC package designer to help us develop our next generation silicon and platforms... of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies...
is looking for an advanced IC package designer to help us develop our next generation silicon and platforms. You will work on cutting-edge FCBGA... of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies...
complex layout IC for high speed applications in advanced CMOS FinFET technologies such as 5nm and 3nm at the block level... in Mixed Signal and Analog RF IC Physical Design or MS in Electrical Engineering, Computer Engineering or related degree...