Job Description: Summary: This position will support the Micross 3D Heterogeneous Integration program areas..., including: Development of semiconductor advanced packaging processes and technologies 2.5/3D integration: TSV processing...
Summary: This position will support the Micross 3D Heterogeneous Integration program areas, including: Development... of semiconductor advanced packaging processes and technologies 2.5/3D integration: TSV processing, wafer thinning & handle wafer...