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Keywords: Technical Specialist - Wiresaw Wafer Slicing, Location: Hemlock, MI

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Technical Specialist - Wiresaw Wafer Slicing

technical expert resource for wiresaw wafer slicing processes, including parameter optimization, wire selection, and maintenance...: In this role, you will be responsible for providing technical leadership and expertise in diamond-coated wire (DCW) wiresaw wafer...

Company: Corning
Location: Hemlock, MI
Posted Date: 11 Jan 2025
Salary: $106331 - 146206 per year

Technical Specialist - Wiresaw Wafer Slicing

technical expert resource for wiresaw wafer slicing processes, including parameter optimization, wire selection, and maintenance...: In this role, you will be responsible for providing technical leadership and expertise in diamond-coated wire (DCW) wiresaw wafer...

Company: Corning
Location: Hemlock, MI
Posted Date: 11 Jan 2025
Salary: $106331 - 146206 per year