Find your dream job now!

Click on Location links to filter by Job Title & Location.
Click on Company links to filter by Company & Location.
For exact match, enclose search terms in "double quotes".

Keywords: Lead Application Packaging, Location: Bangalore, Karnataka

Page: 2

RTL Design Engineer (GPU) - Sr Lead

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging...

Company: Qualcomm
Posted Date: 09 Oct 2024

STA/ Timing Lead Engineer

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail...

Company: Qualcomm
Posted Date: 09 Oct 2024

Advance Lead Engineer

design & development of Cabs structure and packaging as per system / subsystem level requirements complying with standards... for locomotive application using sound Engineering principles, adhering to business standards/ processes and as per program...

Company: Wabtec
Posted Date: 25 Sep 2024

Sr Lead Engineer - DFT

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging...

Company: Qualcomm
Posted Date: 24 Sep 2024

Power Core IP DV Sr Lead Engineer

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail or call...

Company: Qualcomm
Posted Date: 14 Sep 2024

WIFI PHY - Design Verification Sr Lead Engineer

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process...

Company: Qualcomm
Posted Date: 31 Aug 2024

Senior Lead Engineer - DFT

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging...

Company: Qualcomm
Posted Date: 30 Aug 2024

Digital PDTE -- Sr Lead Engineer

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing...

Company: Qualcomm
Posted Date: 16 Aug 2024

DevOps Architect

for deployment automation and packaging and monitoring visibility. Identify tasks and areas where automation can be applied... years of overall experience. 7+ years of development or application engineering in languages such as Python, Ruby, Go...

Company: UST
Posted Date: 30 Oct 2024

Senior Software Engineer

- Job Description The Senior Software Developer (Back end) is part of the overall Ports and Borders Application Software Development group.... Translate architectural concepts into user flows, wireframes, mockups and prototypes that lead to intuitive user experiences...

Posted Date: 26 Oct 2024

Timing Engineer

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... and 1+ year of Hardware Engineering or related work experience. STA/Timing CAD Methodology Lead As an STA CAD...

Company: Qualcomm
Posted Date: 22 Oct 2024

STA/Timing Methodology Sr Staff Engineer

work experience STA/Timing CAD Methodology Lead As an STA CAD methodology lead, the role would expect the candidate... to lead deployment of new features and or methodologies related to STA and ECO domain Scope of the work would cover...

Company: Qualcomm
Posted Date: 22 Oct 2024

STA/Timing Methodology Sr Engineer

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... Engineering or related work experience. STA/Timing CAD Methodology Lead As an STA CAD methodology lead, the role would expect...

Company: Qualcomm
Posted Date: 21 Oct 2024

STA/Timing Methodology Engineer

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... Engineering or related work experience. As an STA CAD methodology lead, the role would expect the candidate to lead deployment...

Company: Qualcomm
Posted Date: 21 Oct 2024

Synthesis Engineer

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... site Develop and maintain 3rd party tool integration and product enhancement routines Should lead implementation flow...

Company: Qualcomm
Posted Date: 19 Oct 2024

Sr Product Manager

, Sales, Corporate Marketing, Partners, and Customers, develop overall go-to-market strategy and plan, including packaging... and in various functions Strong awareness of technology trends and potential influence on F5’s business Ability to lead...

Company: F5
Posted Date: 17 Oct 2024

STAFF R&D/PRODUCT DVL ENGINEER

, you will focus on developing high-quality magnetic sensors (MR-based) for industrial and medical applications. You'll lead the design... continuous learning within the team. Technology Evaluation: Monitor application and technology trends, identifying...

Posted Date: 11 Oct 2024

Principal Software Engineer- UI

. Our Ideal Candidate You are a professional software engineer with full-stack web application development experience.... You are willing to work on many different projects and interested in assuming several responsibilities. Your Responsibilities Lead...

Company: Informatica
Posted Date: 03 Oct 2024

Design Implementation Engineer, Senior

systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch... for quality to lead a high performing and talented team of engineers in the implementation domain for Display Sub-System. Able...

Company: Qualcomm
Posted Date: 28 Sep 2024

Enterprise Analyst - ESD

operational stability Ability to priorities multiple tasks. Scripting experience like VB Script and PowerShell etc Packaging... experience should include Wise Studio, but Install Shield experience may be substituted, along with VB script and SMS packaging...

Company: Unisys
Posted Date: 27 Sep 2024