of semiconductors. Customers from the foundry, logic, memory, automotive, MEMS, advanced packaging and other markets rely upon high... (frontside, backside, and edge) macro inspection that is critical for automotive IC, MEMS, and advanced packaging processes...
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible...
of semiconductors. Customers from the foundry, logic, memory, automotive, MEMS, advanced packaging and other markets rely upon high... (frontside, backside, and edge) macro inspection that is critical for automotive IC, MEMS, and advanced packaging processes...
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... in developing advanced long-range technology in collaboration with product divisions and strategic marketing, working on future...
is preferred Familiarity with chiplet-based architectures and advanced packaging technologies like 2.5D/3D integration... hosting services to global users. The company also offers advanced cloud capabilities for customers with high demands...
/Computer Science/Computer Engineering or relevant discipline At least 6-8 years of relevant DevOps experience Core Technical... with Docker, including writing efficient and secure Dockerfiles. Cloud Integration: Expertise in Azure and AWS services...
and product quality. Skills for Success: Bachelor's Degree in IT/Computer Science/Computer Engineering or relevant discipline.... Cloud Integration: Expertise in Azure and AWS services. HashiCorp Tools: Practical knowledge of Packer, Vault, Terraform...